Primerless fluororesin coating for semiconductor components | Cleanroom compatible
Direct film formation without primer! Strongly suppresses outgassing and particle generation under vacuum and thermal environments.
This is a technical case study of a primer-less fluororesin coating called "HYPERCOAT," which does not use a primer (base adhesive) for components used in semiconductor manufacturing equipment that require a clean environment. By completely eliminating the primer layer and enabling direct film formation, it contributes to a higher level of cleanliness and purity within the equipment. **Main Improvement Effects from Implementation** - **Prevention of Impurity Leaching (Outgassing and Metal Ions)** Since no binder (primer) is used for adhesion, it shuts out the leaching of volatile components (outgassing) and metal ions under vacuum and thermal environments, maintaining the high purity of chemicals and processes. - **Reduction of Coating Delamination to Suppress Particle Generation** There is no heterogeneous interface with the underlying layer, which reduces swelling, interfacial delamination, and chipping of the coating due to chemical environments and thermal cycles. This prevents the dispersion of fine particles into the equipment.
- Company：日建塗装工業
- Price：Other
